Our company provides a variety of FIB services with the highest quality, fastest turn-around, and lowest cost. Our service areas include:

• Modification of integrated circuits (IC);
• Micro-machining;
• Mechanical probing services;
• Plastic chip de-capsulation services;
• TEM and SEM sample preparation;
• R&D on new applications by FIB technology;
• International consulting for FIB technology;
• Magnetic head trimming;
• De-processing and oxide removal using reactive ion etching (RIE);
• Processing monitoring and defect review;
• Testing and failure analysis of microelectronics devices;
• SEM and EDS analysis;
• Flip-chip FA, Debug, and Circuit Modification;
• PCB board design and manufacturing.

Our FIB experts have more than ten years of experience in IC modifications, device failure analysis, sample preparation, materials analysis, pure research, and etc. Our overall yield is higher than 85%. Furthermore, we are highly experienced in new applications based on the successful experimental work on thin film recording head trimming and TEM sample preparation. But most importantly, we know how to plan a project and complete a job promptly and correctly -- the first time!

FIB International is a consultant for Micion Corp. and other companies in the areas of FIB systems evaluation and demonstration. If you are considering purchase a new FIB system, or are interested in increasing the effective utilization of your existing FIB systems, our experience can help. We know how to evaluate a company's analytical needs, we know how to maximize the efficiency of FIB operations, and we know how to get you up to speed quickly with new FIB applications.