 |
 |
 |
 |
 |
||||
| ||||||||
Using advanced FIB technology and utilizing decades of debug experience, FIB International is able to quickly and accurately implement any design changes directly onto your current device. You can save both time and cost by avoiding a new fab run. FIB may also be used to correct design flaws and quickly produce small volumes of engineering samples.
FIB technology with its small and controllable spot size and high beam current density is perfect for micro-machining and nano-fabrication. FIB International can produce any nano structures you need. From AFM tips to apertures to optical lens, we can produce micro structures faster and with higher precision than any existent technology. Take a look at some of our samples.
Due to the complexity of modern day VLSI devices, FA and debugging have become more and more difficult. Internal probing directly on the Device Under Test (DUT) have been incorporated as a critical part of the chip debugging processes. The traditional method of acquiring internal signals is the application of mechanical probes. FIB International has long been involved with the creation of mechanical probe point with its advanced Focused Ion Beam systems. In order to provide its customer with a more complete FA and debugging solution, FIB International now offers mechanical probing as part of its services. Coupled with its decapping, FIBing, and PCB stuffing and reworking services, FIB International is now a one stop probing shop for chip, board, and system level probing. Equipped with the latest active and passive probes, FIB International can probe a large variety of both digital and analog signals looking for both DC voltage levels and critical timing accuracy. Please contact US for more details.
Equipped with the latest in automated decapsulation technology, we
provide safe, quick, reproducible, and precise decapsulation of all plastic
packages, including:
Using either fuming nitric acid or heated fuming sulfuric acid, the decapping system is effective at removing almost all commonly used encapsulants, including urethane and epoxy based molding compounds, along with PVC and ABS plastics. Fuming nitric acid will cleanly expose the die surface while preserving bond pad metallization. Packages with copper lead frames or copper wire can be decapsulated with a mixed acid cycle. FIB International is equipped with a range of alignment fixtures. The customer may select from standard accessory kits or may specify custom fixtures and definition cups.
FIB technology, with both high resolution imaging and high milling
rates, is perfect for creating quick cross sections and TEM Samples. The
major advantage of the FIB over conventional techniques is the ability to
create site specific milling with sub-micron accuracy. From defect review
to process monitoring to material analysis to CD measurements, FIB
technology can create quick and reliable results for all the above
applications.
A major use for the micro-machining capability of the FIB system is to trim and shape magnetic heads. The FIB can be used to reduce the width of the P2 region of MR heads thereby increasing the magnetic resolution of the heads. It can also be used as process monitoring for head production to measure critical dimensions.
Another useful failure analysis technique is dry etching using reactive
ion etching (RIE) or plasma etching. This method can be used to selective
remove materials and de-process an IC. The images below are examples of a
three metal device with just the oxide removed while leaving the
metalization intact. RIE can be used to selective remove just the oxide or
metal layers which allow closer studies of the remaining structures.
