Our company is equipped with the state-of-the-art FIB systems. We currently have six FIB and one SEM systems that include the crown jewels of today's FIB technology: Micrion's Flip-chip machine, the 9500 system, and Dual Column system. Together these systems provide the following unique features:

• 5 nm resolution and sub-micron milling.
• Metal deposition (choices of tungsten or platinum) and insulation deposition (SiO₂).
• Gas assisted etching for insulation or metal. The circular gas delivering system in the Flip Chip system significantly increases the etching rate and uniformity, providing the only way to reach the circuitry from the backside.
• Software packages from Schlumberger and Knights Technologies for CAD navigation.
• Laser interferometer stage allows the search for target within the sub-micron range.
• A built-in infrared microscope offers the only method of viewing the circuitry from the backside.
• Ion beam process and in-situ SEM imaging (dual column systems), provide the highest efficiencies and excellent results for cross-sections and TEM samples.
• Four of our FIB systems have the 8" wafer capabilities.
• High throughput for quantity parts processes.